Details

Subject(s)

• Optical materials—Microstructure [Browse]
• Low temperature plasmas [Browse]

Author

• Kolpakov, Vsevolod A. [Browse]

Bibliographic references

Includes bibliographical references (pages 191-207) and index.

Contents

• Machine generated contents note: ch. 1 Forming Directed Fluxes of Low-Temperature Plasma with High-Voltage Gas Discharge outside the Electrode Gap
• 1.1. Overview of Devices Used for Generating Low-Temperature High-Voltage Gas-Discharge Plasma
• 1.2. Features of Low-Temperature Off-Electrode Plasma Generated by High-Voltage Gas Discharge
• 1.3. Design Changes to the High-Voltage Gas-Discharge Device
• 1.4. New Devices for Generating Directed Fluxes of Low-Temperature Off-Electrode Plasma
• 1.4.1. Multibeam Gas-Discharge Plasma Generator
• 1.4.2. Gas-Discharge Plasma Focuser
• 1.5. Chapter Summary
• ch. 2 Methods for Quickly Measuring Surface Cleanliness
• 2.1. Overview of Methods for Quickly Measuring Surface Cleanliness
• 2.1.1. Method of Frustrated Multiple Internal Reflection Spectroscopy
• 2.1.2. Method of Measuring the Volta Potential
• 2.1.3. Methods for Evaluating Cleaning Efficiency Based on Wettability of the Substrate Surface
• 2.1.4. Tribometric Method
• 2.2. Design Changes to the Tribometer
• 2.3. Operating Regimes and Parameters of the Tribometer
• 2.4. Determining the Evaluation Criterion of a Technologically Clean Surface
• 2.5. Tribometric Effect of the Substrate-Probe on the Structure of the Test Surface
• 2.6. Measuring Surface Cleanliness with the Tribometric Method
• 2.7. A Cleanliness Analyzer Based on Analysis of Drop Behavior
• 2.8. Evaluating the Cleanliness of a Substrate from the Dynamic State of a Liquid Drop Deposited on Its Surface
• 2.8.1. Description of the Experimental Method
• 2.8.1.1. Sample Preparation
• 2.8.2. Description of the Experimental Procedure
• 2.9. Specifications of the Micro- and Nanoroughness Analyzer
• 2.10. Design Changes to the Micro- and Nanoroughness Analyzer
• 2.10.1. Requirements for the Automatic Dispenser
• 2.10.2. Compatibility of the Pump's Control Module and the Analyzer's Software
• 2.10.3. Overview of the Operation of the Modified Analyzer
• 2.11. Chapter Summary
• ch. 3 Increasing the Degree of Surface Cleanliness with Low-Temperature Off-Electrode Plasma
• 3.1. Overview of Methods for Surface Cleaning
• 3.1.1. Chemical Cleaning
• 3.1.2. Laser Cleaning
• 3.1.3. Low-Temperature Plasma Cleaning
• 3.2. Formation Mechanisms of Surface Properties
• 3.3. Molecular Structure Analysis of the Organic Contaminant
• 3.4. Preparing Initial Samples with a Given Degree of Contamination
• 3.5. Analysis of Plasma Particles Impinging on the Surface Being Treated
• 3.6. Mechanism of Surface Cleaning with Directed Fluxes of Low-Temperature Off-Electrode Plasma
• 3.6.1. Cleaning Mechanism
• 3.6.2. Cleaning Model: Primary Expressions
• 3.7. Experimental Investigation into the Relationship between the Degree of Surface Cleanliness and Physical Plasma Parameters
• 3.8. Procedure for Final Surface Cleaning with Off-Electrode Plasma
• 3.9. Chapter Summary
• ch. 4 Adhesion in Metal-Dielectric Structures after Surface Bombardment with an Ion-Electron Flux
• 4.1. Adhesion-Enhancing Mechanism
• 4.2. Adhesion Model: Primary Expressions
• 4.3. Experimental Investigation into the Effect of Ion-Electron Bombardment Parameters on Adhesion
• 4.4. Depositing Highly Adhesive Masks
• 4.5. Chapter Summary
• ch. 5 Etching the Surface Microreliefs of Optical Materials in Off-Electrode Plasma
• 5.1. Preparing Samples for an Experiment in Etching the Surface Microreliefs of Optical Materials in Off-Electrode Plasma
• 5.2. Mechanisms of Plasma-Chemical and Ion-Chemical Surface Etching
• 5.3. Etching Model: Primary Expressions; Algorithm and Software for Calculating the Etch Rate
• 5.4. Experimental Investigation into the Relationship between the Etch Rate and Physical Plasma Parameters
• 5.5. Relationship between the Etch Rate and Substrate Temperature
• 5.5.1. Method for Determining the Temperature of a Surface at a Site Where a Low-Temperature Plasma Flux Is Incident on the Surface
• 5.5.2. Experimental Investigation into the Relationship between the Etch Rate and Substrate Temperature
• 5.6. Effect of Bulk Modification of Polymers in a Directed Low-Temperature Plasma Flux
• 5.7. Etching Quality of Optical Materials
• 5.8. Fabricating Microreliefs on the Surfaces of Optical Materials through Plasma-Chemical Etching in Off-Electrode Plasma
• 5.9. Fabricating Microreliefs on the Surfaces of Optical Materials through Ion-Chemical Etching in Off-Electrode Plasma
• 5.10. Chapter Summary
• ch. 6 Generating a Catalytic Mask for the Microrelief of an Optical Element When an Al-Si Structure Is Irradiated by High-Voltage Gas-Discharge Particles
• 6.1. Entrainment of Silicon Atoms by Vacancies Formed in an Aluminum Melt When Its Surface Is Exposed to High-Voltage Gas-Discharge Particles
• 6.2. Analytical Description of Silicon Dissolution in an Aluminum Melt
• 6.2.1. Conservative Difference Scheme for Diffusion Equations
• 6.2.2. Difference Solution to the Mixed Problem
• 6.2.3. Analysis of Numerical Results
• 6.3. Analysis of Experimental Data
• 6.4. Fabricating a Microrelief Based on a Catalytic Mask Formed in Off-Electrode Plasma
• 6.5. Chapter Summary.

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ISBN

• 9781138197282 ((hardback ; : acid-free paper))
• 1138197289 ((hardback ; : acid-free paper))

LCCN

2017010745

OCLC

974673387

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